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MEMS Design Engineer

Summary:

The MEMS Design Engineer will participate the key MEMS device design activities as they relate to electrostatic actuators, piezoelectric actuators, and other miniaturized actuators with applications in optical devices in portable electronic equipment. The design work will include participating system level design, 3D modeling, analytical modeling, FEA modeling, primary process design, data analysis, and trouble shooting. The MEMS Design Engineer will need to have a fundamental understanding of mechanical structures/systems, MEMS design, MEMS process technology, and packaging technology.
The MEMS Design Engineer will fill a cross-functional role by contributing to product qualification and release to production. As part of the cross-functional development, the MEMS Design Engineer will be part of a collaborative engineering team working with Control System Designer, MEMS process engineer, Layout Design engineer, and Operation team including fabrication, assembly and testing to achieve the technology development milestones.

Essential Responsibilities:

  • Work with System Engineering to set product and design specifications.
  • Participate structural design of MEMS devices
  • Build 3D models of MEMS devices.
  • Work on FEA models and analytical models of MEMS devices.
  • Optimize MEMS device design based on the MEMS models.
  • Participate MEMS process design and optimize MEMS design for production.
  • Work with Test engineering and Operation to define test and characterization plans and summarize characterization results.
  • Work with Operation, Quality, and Reliability on the effective and timely qualification and release to production of new technology.

Required Skills:

  • Proficiency with 3D design tools such as SolidWorks
  • Proficiency with FEA tools such as Autodesk, Coventor, Ansys, etc.
  • Knowledge of analytical tools such as Matlab. Experiences in programming and algorithm development will be a plus.
  • Knowledge of MEMS characterization techniques such as white light interferometry, oscilloscopes, network analyzers, LCR meters, laser vibrometry, etc.
  • Knowledge of failure analysis techniques such as imaging techniques (SEM, FIB, AFM) and/or surface analysis techniques (Raman, FTIR, EDS, XPS). Hands-on experiences will be a plus.
  • Basic knowledge of MEMS process. Hands-on experiences in cleanroom process will be a plus.
  • Basic knowledge of MEMS packaging.
  • Strong written and oral communication skills.

Required Experience:

  • M.S. in Electrical/Electronics Engineering, Mechanical Engineering, Precision Instrument, Applied Physics, or Physics. Ph.D. is a plus.
  • Experience in MEMS development. Experience in a full design cycle is preferred.

Location desired: Nanjing, China